Coming at last: Design sprints from COM Express Compact to COM-HPC After the final ratification of the new COM-HPC Mini standard by the PICMG in October 2023, the first modules are now available on the market. By adding a compact formfactor to the module family, they make COM-HPC the most scalable Computer-on-Module standard today. These new modules also open a future oriented upgrade path for developers of compact COM Express Basic and COM Express Compact systems.
