Coming at last: Design sprints from COM Express Compact to COM-HPC
After the final ratification of the new COM-HPC Mini standard by the PICMG in October 2023, the first modules are now available on the market. By adding a compact formfactor to the module family, they make COM-HPC the most scalable Computer-on-Module standard today. These new modules also open a future oriented upgrade path for developers of compact COM Express Basic and COM Express Compact systems.
High-performance boost for modular systems
The PICMG created the COM-HPC Computer-on-Module standard with the specific aim to address the performance and bandwidth requirements of the digital transformation. Ranking well above COM Express, COM-HPC provides a highly sustainable long-term basis for all current and future applications. The COM-HPC Mini specification facilitates the migration of existing designs to this new high-performance standard.